3. Lithography

Particularly in micro-optical element manufacturing, aspherical structures can be formed directly on the photosensitive material using photolithography, and then the unexposed portion is removed by an etching process, leaving the desired aspherical shape [3].

Photolithography is a common process used in semiconductor manufacturing to create microstructures and circuit patterns on silicon wafers. The following are the main steps in the photolithography process:
Coating Photoresist: A layer of photoresist is coated on the surface of the wafer and then uniformly applied to the surface of the wafer by spin coating or spraying.
Exposure: The wafer is placed in a photolithography machine, and the photoresist undergoes a chemical reaction or physical change in the exposed area by projecting a specific pattern of ultraviolet light or laser beams.
Development: The exposed wafer is immersed in the development solution, which removes the photoresist from the unexposed area and exposes the bottom wafer surface.
Rinse: The wafer is cleaned to remove developer residues and to ensure the clarity and accuracy of the final pattern.
Inspection and Post-processing: The photolithography pattern is inspected to ensure that it meets the design requirements. Further processing steps, such as thin film deposition, etching or ion implantation, can be performed as required.

Photolithography is often used for the manufacture of components for precision instruments because of its delicate and exacting nature. Scientific and technological measuring instruments, such as those mentioned in the previous application, can use precision near-infrared cut-off glass components made by photolithography.

Manufacturing

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